Chiplet

A chiplet[1][2][3][4] is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "LEGO-like" assembly. This provides several advantages over a traditional system on chip (SoC):

  • Reusable IP (Intellectual Property):[5] the same chiplet can be used in many different devices
  • Heterogeneous integration:[6] chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function
  • Known good die:[7] chiplets can be tested before assembly, improving the yield of the final device

Multiple chiplets working together in a single integrated circuit may be called a multi-chip module (MCM), hybrid IC, or 2.5D IC.

References
  1. Brookes (25 July 2021). "What Is a Chiplet?". How-To Geek. Retrieved 28 December 2021.
  2. "Chiplet". WikiChip. Retrieved 28 December 2021.
  3. Semi Engineering "Chiplets" Retrieved 5 December, 2022
  4. Don Scansen, EE Times "Chiplets: A Short History Retrieved 5 December, 2022
  5. Keeler. "Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)". DARPA. Retrieved 28 December 2021.
  6. Kenyon (6 April 2021). "Heterogeneous Integration and the Evolution of IC Packaging". EE Times Europe. Retrieved 28 December 2021.
  7. "Known-good-die meaning". YourDictionary. Retrieved 28 December 2021.
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